Description

Product Overview

FII Number	Xilinx Inc. XC7Z100-2FFG900I
Quantity Available	13
Manufacturer	Xilinx Inc.
Manufacturer Part Number	XC7Z100-2FFG900I
Description	IC SOC CORTEX-A9 KINTEX7 900FBGA
Manufacturer Standard Lead Time	10 Weeks
Detailed Description	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 800MHz 900-FCBGA (31×31)

Documents & Media

Datasheets	XC7Z030,35,45,100 Datasheet Zynq-7000 All Programmable SoC Overview Zynq-7000 User Guide
Product Training Modules	Powering Series 7 Xilinx FPGAs with TI Power Management Solutions
Design Resources	Development Tool Selector
Featured Product	All Programmable Zynq-7000 SoC TE0782 Series with Xilinx Zynq® Z-7035/Z-7045/Z-7100 SoC
PCN Design/Specification	Zynq-7000 Datasheet Update 02/Jun/2014 Zynq-7000 AP Requirement 28/Sep/2015 Cross-Ship Lead-Free Notice 31/Oct/2016 Product Marking Chg 31/Oct/2016
PCN Assembly/Origin	Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014
PCN Packaging	Mult Devices 26/Jun/2017
HTML Datasheet	Zynq-7000 User Guide
Online Catalog	Zynq®-7000

Product Attributes	Select All
Categories	Integrated Circuits (ICs)
Categories	Embedded – System On Chip (SoC)
Manufacturer	Xilinx Inc.
Series	Zynq®-7000
Packaging	Tray
Part Status	Active
Architecture	MCU, FPGA
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size	–
RAM Size	256KB
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	800MHz
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	900-BBGA, FCBGA
Supplier Device Package	900-FCBGA (31×31)
Number of I/O	212
Base Part Number	XC7Z100

Environmental & Export Classifications

Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL)	4 (72 Hours)

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